Product specifications
HS27 - Power SIP Heatsink
The HS27 is designed to be fastened vertically to a PC board by soldering.
Many other heatsinks can be used with this amplifier if a hole is drilled and deburred. Requirements for the potential heatsink or chassis member are flatness of 2 mils per inch in an area large enough to fit the package.
Type ............................................ Board Level, Vertical
Package Cooled ............................... PSIP
Attachment Method .......................... Bolt On and PC Pin
Shape .......................................... Rectangular
Length ......................................... 3.000" (76.20mm)
Width .......................................... 2.360" (59.94mm)
Diameter ....................................... -
Height Off Base (Height of Fin) ............. 0.630" (16.00mm)
Power Dissipation @ Temperature Rise ... -
Thermal Resistance @ Forced Air Flow .... -
Thermal Resistance @ Natural .............. 5.3°C/W
Material ........................................ Aluminum
Material Finish .................................. Black Anodized
- APEX Microtechnology product -